Sr. Principal Product Engineer – Digital & Signoff Group (DSG)

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

Sr. Principal Product Engineer – Digital & Signoff Group (DSG)

Location

Bangalore

Team

Cadence DSG (Digital & Signoff Group)

The Opportunity

Join Cadence’s Digital and Signoff Group (DSG) as a Product Engineer, where you will act as the vital bridge between R&D, Application Engineering, and our global customers. In this high-impact role, you will influence the next generation of chip design software, helping industry leaders solve complex physical design challenges at 7nm and below.

Key Responsibilities

Technical Expert

Serve as the primary place-and-route (P&R) resource for internal development teams and external customers.

Product Evolution

Collaborate with R&D to track, diagnose, and resolve software issues, ensuring a robust tool release cycle.

Design Benchmarking

Execute competitive benchmarks to demonstrate Cadence’s edge in Power, Performance, and Area (PPA).

Flow Innovation

Develop and deploy customized RTL-to-GDSII methodologies and scripts to meet specific customer design goals.

Strategic Collaboration

Partner with Product Marketing to align technical capabilities with market needs and customer roadmaps.

Requirements

Education

Bachelors in Electronics Engineering (EE) + 8 or more years of industry experience,

OR

Masters in Electronics Engineering (EE) + 6 or more year of digital implementation experience.

Core Expertise

Deep understanding of the full ASIC design flow (RTL-to-GDSII) with a focus on physical design and timing analysis.

Advanced Node Experience

Proven hands-on experience with timing closure and PPA optimization at 7nm, 5nm, or below.

Tool Proficiency

High familiarity with industry-standard EDA tools for synthesis, placement, routing, and signoff.

Scripting Skills

Proficiency in Tcl, Python, or Perl (familiarity with AI-driven productivity tools is a major plus).

Communication

Strong verbal and written skills to translate complex technical issues into actionable solutions.

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